Array scanning
Capture consistent acoustic data across components with a non-invasive scanning architecture.
Ultrasonic NDT · Hong Kong
DeepSonix
See beyond the surface. AI-powered ultrasound reveals hidden defects before they become critical.
Non-invasiveContactless defect intelligence
AI-assistedSignal-to-insight workflow
Built in Hong KongResearch translated to industry
Our technology
Precision at every layer
DeepSonix combines ultrasonic array scanning, advanced signal processing and deep learning to help semiconductor teams inspect faster and decide with confidence.
Signal intelligence
Separate meaningful features from noise through an advanced processing pipeline.
Defect insight
Turn complex ultrasonic responses into clear, actionable inspection results.
The platform
From sound wave to production decision
A connected inspection workflow designed for semiconductor devices and high-value components.
- 01Rapid, repeatable ultrasonic acquisition
- 02Automated processing and feature extraction
- 03Visual results for engineering review
Company timeline
Built through research, shaped for industry
Our path from an early-stage idea to an innovation company entering incubation.
HKSTP Ideation
DeepSonix entered the HKSTP Ideation Programme to shape its technology and commercial path.
DeepSonix Limited founded
The company was incorporated in Hong Kong to bring advanced ultrasonic inspection to industry.
Incubation
DeepSonix joins incubation to accelerate product development, validation and market adoption.
Our people
One team, multiple disciplines
Researchers, engineers and operators working together across acoustics, AI, mechanical systems and company building.
Professor W. N. Lee
Chief Scientific Advisor
Associate Professor at HKU with two decades of acoustics research experience.
Klementine Wai
Chief Executive Officer
Leading company strategy, operations and growth.
Bingze Dai
Chief Scientist
HKU doctoral researcher and founder of SoundSense.
Yang Leng
Chief AI Officer
Doctoral researcher in Electrical and Electronic Engineering at HKU.
Shiqi Yang
Chief Mechanical Engineer
Doctoral researcher in Electrical and Electronic Engineering at HKU.
Issac Leung
R&D Engineer
Advancing the inspection platform from research to deployment.
Academic collaboration
Advanced Alloys LaboratoryDepartment of Mechanical Engineering, The University of Hong Kong
Solve a hard inspection problem with us
We welcome conversations with semiconductor manufacturers, research teams and engineering partners.
Start a conversationContact
Bring clarity to what lies beneath
Tell us about your component, material or inspection challenge. Our team will follow up to explore the right next step.